qualcomm 8195 datasheet
endobj [265][266] Co-developed with Microsoft, it was exclusively designed for Microsoft's Surface Pro X. Technically, it's a Snapdragon 8cx SoC with faster Adreno 685 GPU core providing performance of 2100 GFLOPs. ThunderSoft | The Snapdragon 632 was announced on June 26, 2018. H\0y9aXw&cWXD{7.l@ 3TfwYOCwJDmVBq9 #;}0 G]i7o7\BTZr#e`TkDs!*z=1HqX2E]k]yj>!tBy#aFad 0000000016 00000 n 0000022350 00000 n Just a couple weeks ago, we uncovered the work that is beginning on the flagship-level MT8195 chip in the Chromium Gerrit, but there wasn't a device tied to it just yet. 0000025578 00000 n The Snapdragon 662 was announced on January 20, 2020, with NavIC support. 0000015106 00000 n Both the MT8192 and MT8195 integrate a high performance AI processing unit (APU) to accelerate a wide range of voice and vision-based applications in real-time, as well as a dedicated digital signal processor (DSP) for audio to enable ultra-low power voice wakeup (VoW) for digital assistants. Similar to the 2 Series, it is the successor of the S4 Play. DK-CSRA68105-TFBGA213-A- CSRA68105 Bluetooth Development Kit. <>/Metadata 14 0 R/OpenAction 521 0 R/PageLayout/SinglePage/Pages 13 0 R/StructTreeRoot 16 0 R/Type/Catalog/ViewerPreferences<>>> The Snapdragon 460 was announced on 20 January 2020, with NavIC support. It is the first Snapdragon 400 model to incorporate the Kryo architecture. [127] 0000002108 00000 n 0000002501 00000 n jC9P>8Hpaw5F. The Snapdragon 8cx Compute Platform for Windows 10 PCs was announced on December 6, 2018. ), The Snapdragon 835 was announced on November 17, 2016.[180]. Sorry, no parts were found that match that search query. 3x 22MP ZSL); The third-generation Snapdragon Automotive Development Platform (ADP) based on the Qualcomm Snapdragon SA8155P processor from Qualcomm Technologies, Inc. (QTI) provides OEMs and ecosystem partners with access to QTI's high-performance automotive infotainment, advanced driver assist platform for developing, testing, optimizing and showcasing [330] The Razer Edge is the first device to use the platform. endobj MMSolutions. 0000056427 00000 n Starting with the Snapdragon 610, the 600 series is a mid-range SoC lineup, as opposed to the original Snapdragon 600, which was a high-end model. Qualcomm has introduced 5G M.2 card reference designs based on Snapdragon X65 and X62 5G modems with the aim of accelerating 5G adoption in PCs, Always-Connected PCs (ACPCs), laptops, Customer Premises Equipment (CPEs), XR, gaming, and other mobile broadband (MBB) devices. 0000007368 00000 n 0000606587 00000 n <> 0000013571 00000 n FastConnect 6700, Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6) 2x2 (MU-MIMO), NFC, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1; Spectra (24 MP at 30fps single camera with MFNR/ZSL). The Snapdragon 618 and Snapdragon 620 were announced on February 18, 2015. 0000447862 00000 n endstream 0000000016 00000 n [44][45], Snapdragon 630, 636 and 660 are pin and software compatible. trailer 0000008836 00000 n The Qualcomm 215 was announced on July 9, 2019. [33] It is a toned-down variant of the Snapdragon 425 and primarily optimized for Android Go Edition devices. }, 0000009323 00000 n trailer Unlike the 7c are the configuration and ARM architecture. 51 QUALCOMM Evaluation, Development Boards and Kits. onFormReady: function ($form) { ARMv6, ARMv7-A, ARMv8-A, ARMv9-A. 0 The SA8155P Snapdragon processor includes eight Kryo CPUs, a Qualcomm Adreno 640 GPU and high-performance Hexagon 6 DSP. 0000060931 00000 n 0000073506 00000 n 1, 2, 4, 6, or 8. 0000135738 00000 n The Snapdragon 800 for Embedded QAM-8195P-1-BGM1370-MT-00--AB. 0000042875 00000 n 0000005779 00000 n 0000027775 00000 n 154 0 obj <>/Filter/FlateDecode/Index[16 132]/Length 27/Size 148/Type/XRef/W[1 1 1]>>stream 156 0 obj 0000060986 00000 n [58]The Snapdragon 480+ was announced on October 26, 2021. 0000035774 00000 n <> [109], The Snapdragon 730 and 730G were announced on April 9, 2019. 0000027210 00000 n <> 0000045880 00000 n HV]o7|# Dgw8 D"vXyjBeGu$i}g,;{]]. 0000006733 00000 n 3x 2.42 GHz Kryo 485 Gold (Cortex-A76 based) +, 4x 1.8 GHz Kryo 485 Silver (Cortex-A55 based), 22 MP at 30fps dual camera with MFNR/ZSL), External: X505G[211] (5G only: download upto 5 Gbit/s), 1 + 3 + 4 cores (2.96GHz + 2.42GHz + 1.80GHz), External: X55 (5G: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to .316 Gbit/s), The Snapdragon 865 was announced on December 4, 2019. <<9451939F29B4B2110A005095E0B5FE7F>]/Prev 746471/XRefStm 1318>> [59], The Snapdragon 6 Gen 1 was announced on September 6, 2022. Notable features over its predecessor (845): The Snapdragon 855+ was announced on July 15, 2019.[209]. endobj 0000005376 00000 n 0000002641 00000 n 0000042625 00000 n 0000032822 00000 n 0000026601 00000 n 0000007596 00000 n 2 RGB planes, 2 VIG planes, 1080p, 4KiB + 4KiB L0 cache, 16KiB + 16KiB L1 cache and 2MiB L2 cache, Up to 1024 KB On-chip graphics memory (From 512 KB on, Up to 21 megapixel, stereoscopic 3D 24dual image signal processor (supports, Throughput: 1.0 GP/sec (From 0.64 GP/sec on S800), Up to 128-bit wide LPDDR3 memory interface, Support for hull, domain and geometry shaders, Update with new dedicated connection to the memory controller(From shared bus with the video decoder and ISP), Up to 40% increase performance in shader hardware, 1.5x larger L2 cache (1536 KB from 1024 KB), Throughput: 1.0 GP/sec (From 0.64 GP/sec on SD800), Up to 48KB Data + 32KB Instr. <> 0000073315 00000 n 0000017986 00000 n [51] Pin and software compatible with Snapdragon 625, 626 and 450; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439. 0000075152 00000 n 0000164553 00000 n The Snapdragon 617 was announced on September 15, 2015. The Snapdragon 450 was announced on June 28, 2017. HDR10, HLG, HDR10+ video recording; 10-bit HDR photo, (1x 192MP, 0000028322 00000 n 0000014333 00000 n Physical specifications. The Qualcomm 205 Mobile Platform formally falls under the Mobile Platform brand, but is practically a Snapdragon 208 with a X5 LTE modem. The 855 Plus is an identical, but higher clocked version of this processor. 183 0 obj 1x 64MP ZSL, XPM6320 990Kb / 19P: 20W fast charge and discharge fully integrated power management chip XPM6329 967Kb / 18P: Qualcomm SA8155P, Qualcomm Adreno, Qualcomm FlexRender, Qualcomm Kryo and Qualcomm SirfStar are products of Qualcomm Technologies, Inc. and/or its subsidiaries. 0000051996 00000 n 0000003872 00000 n [170], Notable features over its predecessor (Snapdragon 808 and 810):[167], The Snapdragon 821 was announced on August 16, 2016.[175]. <>stream The Snapdragon 415 and the older Snapdragon 425 (later cancelled) were announced on February 18, 2015. 0000015602 00000 n Notable features over its predecessor (Snapdragon 820): upto 600Mbit/s; 3x20 MHz CA; 64-QAM; 4x4 MIMO on 1C. Ever", "Qualcomm Drives 5G PC Ecosystem Expansion with Next Generation Compute Platform, Powering New 2-in-1 Laptops from OEMs Including Acer in 2020", "Snapdragon 8cx Gen 2 5G Compute Platform", "Surface Pro X: Cristiano Amon shares how Qualcomm and Microsoft are redefining mobile computing", "All we Know About Microsoft's Custom SQ1 Processor Inside the Surface Pro X", "The Surface Pro X gets better: Qualcomm and Microsoft continue redefining mobile computing", "Meet Snapdragon Wear 1100the processor behind your next wearable tracker", "Qualcomm Announces Cutting-Edge Wearables Platform Supporting LTE IoT Categories M1 and NB1 for Next Generation Connected Wearable Devices", "The Snapdragon Wear 2100 is made for next-gen wearables", "Qualcomm Helps to accelerate 4G Kid Watch Segment with Dedicated Snapdragon Wear 2500 Platform", "Qualcomm Snapdragon Wear 3100 Platform Supports New Ultra-Low Power System Architecture for Next Generation Smartwatches", "Qualcomm Snapdragon Wear 4100 Platforms Enable New and Enhanced User Experiences to Fuel Accelerated Wearables Growth", "Qualcomm Launches Snapdragon W5+ and W5 Platforms for Next Generation Wearables: Our Most Advanced Leap Yet", "Snapdragon Wear 4100 Platform Product Brief", "Snapdragon W5 Gen 1 Platform Product Brief", "Qualcomm Introduces Snapdragon Automotive Solutions for Connected In-Car Infotainment", "Snapdragon 820 Automotive processors debut at CES 2016", "Snapdragon 600E and 410E processors help IoT manufacturers design, build, and scale", "Qualcomm Snapdragon 600E and 410E Designed for Embedded Computing, Internet of Things Applications Now Widely Available", "Qualcomm Extends its Embedded Computing Portfolio and Brings its Premium Tier Processors for Cutting-Edge IoT Applications", "Qualcomm Unveils the Vision Intelligence Platform Purpose-built for IoT Devices Powered by Latest Advances in Camera, AI and Computer Vision", "Made for the IoT: Meet the Qualcomm Vision Intelligence Platform", "Qualcomm Announces Highly Flexible Smart Speaker Platform with Unique Combination of Support for Voice Assistants and Multi-Room Streaming Audio Capability", "Qualcomm Announces New Home Hub Platforms Supporting Android Things to Bring the Google Assistant into Households Everywhere", "Qualcomm Launches New, AI-Enabled Highly Integrated SoCs and Dedicated Smart Speaker Platform to Help Drive the Evolution of Smart Audio", "Qualcomm Announces XR1 Platform: Dedicated SoC for VR/XR Headsets, Coming Late 2018", "Lantronix Open-Q 865XR SoM Brings Snapdragon XR2 Processor Beyond Virtual Reality - CNX Software", "IQualcomm Technologies Announces the World's First 5G XR Platform", "Qualcomm Powers the Next Generation of Mixed and Virtual Reality Devices with the Snapdragon XR2+ Platform", "$399 Razer Edge tries to make Android gaming tablets happen", "Qualcomm Introduces Snapdragon G3x Gen 1 Gaming Platform to Power a New Generation of Dedicated Gaming Devices", "Amazon.com, Qualcomm to put Alexa assistant in more headphones", "Google, Qualcomm working to help create more Fast Pair and Assistant headphones", "Qualcomm wants to triple Bluetooth headphone listening time", "Launch Studio - D046352 Listing Details", "Launch Studio - D046351 Listing Details", "LE Audio: A new age of Bluetooth audio sharing", "New Ultra-Low Power Bluetooth Audio SoCs From Qualcomm Improve Truly Wireless Sound", "New audio technologies help bring out the best in truly wireless earbuds", "QCC3040 | Entry-Level TrueWireless Bluetooth Audio BGA SoC", "QCC3046 | Mid-Level TrueWireless Bluetooth Audio WLCSP", "QCC5141 Chipset | Premium-tier WLCSP package for TrueWireless Earbuds", "QCC5144 Chipset | Premium BGA package for TrueWireless Earbuds", AML8726, MX, M6x, M801, M802/S802, S812, T86, MT8161, MT8163, MT8165, MT8732, MT8735, MT8752, Exynos 7872, 7884, 7885, 7904, 9609, 9610, 9611, SAM9G, SAM9M, SAM9N, SAM9R, SAM9X, SAM9XE, SAM926x, https://en.wikipedia.org/w/index.php?title=List_of_Qualcomm_Snapdragon_systems_on_chips&oldid=1142060997, All articles with bare URLs for citations, Articles with bare URLs for citations from March 2022, Articles with PDF format bare URLs for citations, Short description is different from Wikidata, Articles with unsourced statements from February 2021, Articles with failed verification from September 2021, Creative Commons Attribution-ShareAlike License 3.0, Bluetooth 2.0/2.1 (external BTS4025); 802.11b/g/n (external WCN1314); gpsOne Gen7; USB2.0, Bluetooth 2.0/2.1 (external BTS4025); 802.11b/g/n (external WCN1312); gpsOne Gen7; USB2.0, Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external AR6003/5, WCN1314); gpsOne Gen7; USB2.0, Bluetooth 2.0/2.1 (external BTS4025); 802.11b/g/n (external AR6003); gpsOne Gen7; USB2.0, Bluetooth 4.0 (external WCN2243) or Bluetooth 3.0 (external QTR8x00); 802.11b/g/n (external WCN1314); gpsOne Gen8 with GLONASS; USB2.0, Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external WCN1314); gpsOne Gen8 with GLONASS; USB2.0, Bluetooth 3.0 (external); 802.11b/g/n 2.4GHz (external); GPS: IZat Gen7; USB2.0, UMTS (DC-HSPA+, TD-SCDMA); GSM (GPRS, EDGE), Bluetooth 4.0; 802.11b/g/n (2.4/5GHz); GPS: IZat Gen8A; USB2.0. 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